pk 524 (v1.2) o ctober 12 , 2012 www.xilinx.com 1 pk 524 ( v 1 .2 ) o ctober 12 , 2012 100% material declaration data sheet for 7 series f f g900 average weight: 11 . 5795 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.296758 2.5 63 silicon (si) 7440- 21- 3 100.00 basis 0.296758 solder bump 0.0193 15 0.167 tin (sn) 7440- 31- 5 63.00 0.012168 lead (pb) 7439- 92- 1 37.00 0.007147 solder paste 0.071000 0.613 tin (sn) 7440- 31- 5 96.50 basis 0.068515 silver (ag) 7440- 22- 4 3.00 basis 0.002130 copper (cu) 7440- 50- 8 0.50 basis 0.000355 capacitor 1 0.023400 0.202 batio3 type 12047- 27- 7 70.60 ceramic 0.016520 nickel (ni) 7440- 02- 0 6.70 inner electrode 0.001568 copper (cu) 7440- 50- 8 20.10 outer electrode 0.004703 nickel (ni) 7440- 02- 0 0.80 plating 1 0.000187 tin (sn) 7440- 31- 5 1.80 plating 2 0.000421 capacitor 2 0.003800 0.033 batio3 type 12047- 27- 7 61.70 ceramic 0.002345 nickel (ni) 7440- 02- 0 4.89 inner electrode 0.000186 indium tin oxide 50926- 11- 9 18.30 outer electrode 0.000695 copper (cu) 7440- 50- 8 13.40 outer electrode 0.000509 nickel (ni) 7440- 02- 0 0.49 plating 1 0.000019 tin (sn) 7440- 31- 5 1.22 plating 2 0.000046 capacitor 3 0.002400 0.021 batio3 type 12047- 27- 7 66.00 ceramic 0.001584 nickel (ni) 7440- 02- 0 2.67 inner electrode 0.000064 copper (cu) 7440- 50- 8 23.33 outer electrode 0.000560 nickel (ni) 7440- 02- 0 2.33 plating 1 0.000056 tin (sn) 7440- 31- 5 5.67 plating 2 0.000136 ? copyright 201 2 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet ? 7 series f fg900 pk 524 (v1.2) o ctober 12 , 2012 www.xilinx.com 2 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total capacitor 4 0.012880 0.111 batio3 type 12047- 27- 7 51.10 ceramic 0.0 06582 copper (cu) 7440- 50- 8 27.00 inner electrode 0.003478 nickel (ni) 7440- 02- 0 16.90 outer electrode 0.002177 nickel (ni) 7440- 02- 0 2.00 plating 1 0.000 258 tin (sn) 7440- 31- 5 3.00 plating 2 0.000 386 under fill 0.053000 0.4 58 bisphenol f/ epichlorohydrin copolymer 9003- 36- 5 20.00 basis 0.010600 phenolic resin trade secret 15.00 basis 0.007950 bisphenol a type liquid epoxy resin 25068- 38- 6 5.00 basis 0.002650 amine type accelerator trade secret 5.00 basis 0.002650 silicon dioxide 60676- 86- 0 51.50 basis 0.027295 carbon black 1333- 86- 4 1.00 basis 0.000530 additives trade secret 2.50 additive 0.001325 lid 7.639000 65.970 copper (cu) 7440- 50- 8 99.80 main material 7.623722 nickel (ni) 7440- 02- 0 0.1 0 main material 0.007639 nickel sulfate 7786- 81- 4 0.10 main material 0.007639 lid adhesive 0.102000 0. 881 aluminum oxide ai203 1344- 28- 1 70.00 basis 0.0 71400 dimethyl siloxane, dimethylvinyl - terminated 68083- 19- 2 30 .00 basis 0. 030600 solder ball 0.751829 6.493 tin (sn) 7440- 31- 5 96.50 main material 0.725515 silver (ag) 7440- 22- 4 3.00 main material 0.022555 copper (cu) 7440- 50- 8 0.50 main material 0.003759 substrate 2.604098 22.489 copper (cu) 7440- 50- 8 40.10 1.044296 tin (sn) 7440- 31- 5 0.82 0.021224 lead (pb) 7439- 92- 1 0.17 0.004427 silver (ag) 7440- 22- 4 0.02 0.000417 bt core n/a 43.50 1.132886 abf n/a 13.14 0.342231 solder mask trade secret 2.25 0.058617
100% material declaration data sheet ? 7 series f fg900 pk 524 (v1.2) o ctober 12 , 2012 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardwar e devices to independent third - party vendors and materials suppliers (?contractors?). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information whic h is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 0 3 /2 9 /2012 1.0 initial xilinx release. 08/17/2012 1.1 updated component names 1 0 /1 2 /2012 1.2 updated substrate component
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